Process Date: February 2000

Marked with the FH "Index" marking head and Synrad laser, using 5 watts at 30"/ second.

The cutting of polyimide material for flex circuits and other electrical applications is a highly specialized area, with lasers of wavelengths in the 9.3-9.4 micron range commonly used in their processing. However, the material can be easily marked using a standard 10.6 micron wavelength laser, to leave a slightly engraved, but contrasting mark. On thick polyimide, the material requires no cleaning, whereas thin films may require some light cleaning to remove charred sections.